Curve Semiconductors

SineSemi (中晶新源) has announced that five of its automotive-grade SGT products have been included in the 2026 China Automotive Chip Supply Handbook (《2026中国汽车芯片供给手册》). The handbook was released at the 2026 Integrated Circuit (Wuxi) Innovation Development Conference (2026集成电路（无锡）创新发展大会).

The handbook's organizing context

According to SineSemi's September 22 announcement, the handbook was compiled under the guidance of relevant national ministries, with the China Automotive Chip Industry Innovation Strategic Alliance (中国汽车芯片产业创新战略联盟) leading its organization. Nearly 100 chip-design companies belonging to the alliance participated.

The announcement describes the handbook's purpose as connecting automotive-chip supply and demand and accelerating the use of domestically developed semiconductor chips in vehicles.

Five products included

SineSemi's product display identifies the following five devices:

SMT400SAHPWQ
SMT4001AHPWQ
SMT4004AHPHQ
SMT4005AHPQ
SMT4005AHPDQ

SineSemi presents all five as 40V automotive-grade SGT products. Its display associates them with applications spanning electric power steering (EPS), 12V battery management, automotive pumps and fans, electronic parking brakes, seats, door locks and other vehicle body functions.

SGT process and simulation support

SineSemi says its shielded-gate trench (SGT, 屏蔽栅沟槽) process is designed to reduce on-resistance and Miller gate charge and optimize the device figure of merit (FOM). The company also describes automotive-oriented process controls intended to support parameter consistency and stable production yield.

For device design, SineSemi highlights a reinforced chip-protection layer and reliability-oriented design redundancy. It says Spice Model simulation support helps customers identify design issues at an early stage.

Packaging for automotive operation

The announcement describes coordination between chip process and packaging, including copper-clip interconnects and thin-wafer packaging capability. SineSemi attributes improved heat dissipation to these packaging technologies.

SineSemi also highlights Wettable Flank + long-lead packaging, which it says is intended to improve production efficiency and reliability and address vibration requirements during long-term automotive operation.

Reliability requirements and manufacturing context

SineSemi states a 2,000-hour reliability requirement, which it describes as exceeding automotive-grade standards. The announcement also refers to automotive qualification work through SGS; its product display cites AEC-Q101 and PPAP support. These are SineSemi's statements about its automotive offering. The announcement does not provide detailed test conditions or individual qualification reports for the five devices.

The company identifies ChipON Integrated (芯联集成) as a strategic shareholder. According to SineSemi, ChipON Integrated provides wafer-manufacturing capabilities spanning 8-inch and 12-inch capacity. SineSemi also cites IATF 16949 and VDA 6.3 qualifications and recognition from domestic and international automakers in describing this manufacturing context.

Continuing automotive SGT development

SineSemi says it will continue developing its SGT technology platform, automotive power devices and industry partnerships to support new-energy and intelligent-vehicle systems.

Source: SiNESEMI中晶新源半导体, “权威认可｜中晶新源多款车规级 SGT 产品入编《2026 中国汽车芯片供给手册》”, published September 22, 2026. This article is based solely on that announcement. Product, technical, reliability, qualification, manufacturing and market-recognition statements are attributed to SineSemi.