Power Semiconductor Technologies
A concise map of the device and packaging technologies available through Curve, supported by technology partners for different voltage, frequency, thermal and power-density needs.
Technology Portfolio Overview
Different Technologies for Different Operating Windows
No single device technology is the best fit for every design. This overview helps orient an initial discussion; detailed selection depends on the application and the relevant product datasheet.
SGT MOSFET
A silicon MOSFET structure commonly used where low on-resistance and high current capability are priorities at low to medium voltages. SGT devices in the technology portfolio available through Curve support applications such as motor drives, battery systems and power conversion.
Explore SGT and Superjunction MOSFETsSuperjunction MOSFET
A high-voltage silicon MOSFET architecture typically considered for efficient switching in offline power supplies, lighting, charging and other power-conversion systems. It is especially relevant when designers need to balance conduction and switching performance in the 500–650 V class.
Compare SGT and Superjunction MOSFETsIGBT
A proven silicon option for higher-voltage, higher-power systems operating at moderate switching frequencies. The technology portfolio supported by Curve's partners can address industrial drives, inverters, power supplies and related energy-conversion applications.
SiC and GaN
Wide-bandgap technologies extend the available operating landscape. SiC is often considered as voltage, temperature and power requirements rise, while GaN is typically attractive where very high switching frequency and compact power conversion are central design goals.
Read about SiC and GaNAdvanced Packaging
Packaging That Supports Electrical and Thermal Performance
The packaging portfolio available through Curve includes compact PDFN formats, TOLL and TOLT options, and top-side-cooling approaches. These formats can support lower-parasitic layouts, effective thermal paths and greater power density when matched to the device and system design.
Explore TOLL, TOLT and top-side coolingPDFN
Compact surface-mount formats suited to space-conscious, high-current layouts.
TOLL
A leadless package format designed for a compact footprint and effective board-side heat flow.
TOLT
A top-side-cooling format that separates the main thermal path from the PCB.
Top-side cooling
A system approach that can move heat directly from the package into a dedicated thermal solution.
Technology Selection
Typical Strengths and Operating Regions
Directional positioning for early-stage comparison. Actual operating limits and suitability vary by device, package, circuit topology and thermal conditions.
| Technology | Typical voltage region | Switching frequency | Typical strengths | Representative applications |
|---|---|---|---|---|
| SGT MOSFET | Low to medium | High | Low conduction loss, high current density | Motor drives, battery systems, DC-DC conversion |
| Superjunction MOSFET | High, commonly 500–650 V | Medium to high | High-voltage silicon switching efficiency | Offline power, lighting, chargers, PFC |
| IGBT | High | Low to medium | Robust high-power operation | Industrial drives, inverters, power conversion |
| SiC | High to very high | Medium to high | High-voltage, high-temperature and high-power capability | EV, charging, solar, industrial power |
| GaN | Low to high | Very high | Fast switching and high power density | Compact adapters, data-centre power, high-frequency conversion |
Technical Library
Related Design Insights
Continue into the detailed engineering notes for structures, trade-offs and design considerations.
SGT vs Superjunction MOSFET: Structure, Performance and Applications
A closer look at how the two silicon MOSFET architectures differ and where each is commonly used.
Read insightWhy Power Electronics Is Moving Toward SiC and GaN
An introduction to the properties, trade-offs and application fit of wide-bandgap power devices.
Read insightTOLL, TOLT and Top-Side Cooling
A practical guide to package construction, thermal paths and system-level design considerations.
Read insightMOSFET Design for Compact Robotic Joint Drives
Application-focused guidance on RDS(on), gate charge, SOA and thermal paths in dense robotic actuators.
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